SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to dissipate the heat generated from a logic semiconductor chip using a heat radiation cap and to prevent performance degradation. CONSTITUTION: A memory chip(20) is adhered on a package substrate(10). A logic semiconductor chip(30) is adhered on the memory chip. A printed circuit board(23) includes a first pad(12) and a second pad(13). An inner solder ball(33) is arranged between the memory chip and the logic semiconductor chip. A heat radiation cap(43) covers the memory chip and the logic semiconductor chip. A heat transfer matter(41) is arranged between the heat radiation cap and the logic semiconductor chip.