| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a base plate and a semiconductor device capable of alleviating distortion caused by screwing. <P>SOLUTION: A base plate 11 has first and second surfaces 11a, 11b opposed to each other and includes a first region which is formed into a protrusion shape on the second surface 11b side and is provided in the central part and a second region which is located in the peripheral part excluding the central part. A thickness H2 of the second region 11d is thinner than a thickness H1 of the first region 11c. <P>COPYRIGHT: (C)2013,JPO&INPIT |
