发明名称 RESIN COMPOSITION AND RESIN MOLDED ARTICLE
摘要 A resin composition contains (A) a polylactic acid, (B) a polyhydroxyalkanoate, (C) an ammonium polyphosphate, and (D) a phenol-modified epoxy compound. With respect to the total amount of the resin composition, the polylactic acid (A) and the polyhydroxyalkanoate (B) are contained from about 60% by mass to about 95% by mass; the ammonium polyphosphate (C) is contained from about 4% by mass to about 35% by mass; the phenol-modified epoxy compound (D) is contained from about 1% by mass to about 5% by mass; the polylactic acid (A) is contained from about 40% by mass to about 90% by mass; the polyhydroxyalkanoate (B) is contained from about 5% by mass to about 55% by mass; and the amount ratio of the polylactic acid (A) to the polyhydroxyalkanoate (B) is from about 0.7 to about 18.
申请公布号 US2013096243(A1) 申请公布日期 2013.04.18
申请号 US201213439519 申请日期 2012.04.04
申请人 YAO KENJI;FUJI XEROX CO., LTD. 发明人 YAO KENJI
分类号 C08L67/04;C08K5/1515 主分类号 C08L67/04
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