发明名称 COPPER FOIL COMPLEX
摘要 A copper foil composite comprising a copper foil and a resin layer laminated thereon, wherein equation 1:(f 3 x t 3 )/(f 2 x t 2 ) => 1 is satisfied when t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and equation 2:1 <= 33f 1 /(F x T) is satisfied when f 1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite.
申请公布号 EP2581220(A1) 申请公布日期 2013.04.17
申请号 EP20110806591 申请日期 2011.06.16
申请人 JX NIPPON MINING & METALS CORPORATION 发明人 KAMMURI KAZUKI
分类号 B32B15/085;B32B15/08;B32B15/09;B32B15/20;H05K1/03;H05K3/02 主分类号 B32B15/085
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