发明名称 |
LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USING THE BONDING MATERIAL |
摘要 |
<p>Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230°C or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.</p> |
申请公布号 |
EP2581156(A1) |
申请公布日期 |
2013.04.17 |
申请号 |
EP20110792572 |
申请日期 |
2011.06.10 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
ENDOH KEIICHI;HISAEDA YUTAKA;MIYAZAWA AKIHIRO;NAGAHARA AIKO;UEYAMA TOSHIHIKO |
分类号 |
B22F9/00;B22F1/00;B22F1/02;B82Y30/00;C22C5/06;H01B1/00;H01B1/22;H01L21/52;H01L23/00;H05K3/32;H05K3/34 |
主分类号 |
B22F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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