Electronic device encapsulation structure and method for making such a structure

摘要

The structure (200) has a first cavity (206) bounded by a support (104) i.e. semi-conductor wafer, and a cap (208) placed on the support. An aperture (210) passes through the cap and communicates an inside of the first cavity with a portion of getter material (218d) provided in a second cavity (215). The second cavity is arranged on the support and placed adjacent to the first cavity. A part of the portion of getter material is provided on the support or against an outer side wall of the first cavity. The first cavity and the second cavity together form a hermetically sealed volume. An independent claim is also included for a method for manufacturing a structure for encapsulating an electronic device.