GLASS SUBSTRATE MANUFACTURING METHOD AND GLASS SUBSTRATE

摘要

Disclosed is a manufacturing method of 100µm or thinner glass substrates which have the quality required of substrates on which thin film circuits are formed; also disclosed is the thin glass substrate manufactured according to that method. The method for manufacturing glass substrates between 10 and 200µm thick involves a formation step for forming molten glass into a ribbon form by the downdraw method, a slow cooling step for slowly cooling the glass ribbon, and a cutting step for cutting the glass ribbon. In the temperature range of (slow cooling point + 200C) to (slow cooling point + 50C), the average cooling speed is adjusted to the range of 300-2500 C/minute.