| 摘要 |
<p>Disclosed is a micro speaker module capable of reducing the thickness of an enclosure that supports a micro speaker. The enclosure of the disclosed micro speaker module includes a first frame having a supporting portion configured to support the micro speaker, and a second frame configured to cover an open side of the first frame. A first cover and a second cover are respectively insert injection molded with or attached to portions of the first frame and the second frame corresponding to the micro speaker that is supported by the supporting portion, which results in a reduction in the thickness of each frame.</p> |
