| 摘要 |
The present invention relates to a building component having a low thermal conductivity value comprising wood material having a 90 th percentile density of between 300 and 460 kg/m 3 , i.e. a low density wood material. The present invention also relates to building components such as window components, i.e. sashes and frames and door components such as door frames, and window insulation materials comprising the low density wood material. The present invention further relates to a method for sorting out wood material having a low density. |
