发明名称 Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
摘要 A light-emitting apparatus package of the present invention includes (i) an electrically insulated ceramic substrate, (ii) a first concave section formed in the direction of thickness of the ceramic substrate so as to form a light exit aperture in a surface of the ceramic substrate, (iii) a second concave section formed within the first concave section in the further direction of thickness of the ceramic substrate so that one or more light-emitting devices are provided therein, (iv) a wiring pattern for supplying electricity, which is provided in the first concave section, and (v) a metalized layer having light-reflectivity, which is (a) provided between the light-emitting device and the surface of the second concave section of the substrate, and (b) electrically insulated from the wiring pattern. On the account of this, the light-emitting apparatus package in which heat is excellently discharged and light is efficiently utilized and a light-emitting apparatus in which the light-emitting apparatus package is used can be obtained.
申请公布号 US8421109(B2) 申请公布日期 2013.04.16
申请号 US201113222739 申请日期 2011.08.31
申请人 INOGUCHI TSUKASA;SHARP KABUSHIKI KAISHA 发明人 INOGUCHI TSUKASA
分类号 H01L33/00;G02F1/1335;G02F1/13357;H01L25/075;H01L33/46;H01L33/48;H01L33/62;H01L33/64;H01S3/04;H01S5/00 主分类号 H01L33/00
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