发明名称 |
Integrated circuit packaging system with dual side connection and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a first terminal; connecting an integrated circuit to the first terminal; forming a second terminal connected over the first terminal and the integrated circuit by a vertical conductive post integral with the first terminal or the second terminal; and encapsulating the integrated circuit and the vertical conductive post leaving portions of the first terminal and the second terminal exposed. |
申请公布号 |
US8421210(B2) |
申请公布日期 |
2013.04.16 |
申请号 |
US20100785951 |
申请日期 |
2010.05.24 |
申请人 |
CHI HEEJO;PARK SOO JUNG;MYUNG JUNWOO;STATS CHIPPAC LTD. |
发明人 |
CHI HEEJO;PARK SOO JUNG;MYUNG JUNWOO |
分类号 |
H01L23/488;H01L21/60 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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