A heat dissipation device is used to dissipate heat generated by a number of memory chips of a motherboard. The heat dissipation device includes a bracket attached to the motherboard and at one side of the memory chips, at least one fan, and at least one connection member attached to the corresponding fan. The fan is adjustably attached to the bracket by the connection member.
申请公布号
US8422226(B2)
申请公布日期
2013.04.16
申请号
US201113045574
申请日期
2011.03.11
申请人
YE ZHEN-XING;TANG XIAN-XIU;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD.