发明名称 |
Semiconductor device, electronic apparatus, and manufacturing methods thereof |
摘要 |
According to one embodiment, a semiconductor device includes a semiconductor substrate having a first surface and a second surface at an opposite side thereof. The first surface has an active layer with a light-receiving part. The semiconductor device also includes an adhesive layer provided to surround the light-receiving part on the first surface of the semiconductor substrate; a light-transmissive protective member disposed above the light-receiving part of the semiconductor substrate with a predetermined gap and adhered via the adhesive layer; and plural external connection terminals arranged in a predetermined array on the second surface of the semiconductor substrate are included. Each center point of the external connection terminals forming two facing edges is positioned inside of an area of the adhesive layer projected on the second surface among the outermost external connection terminals. |
申请公布号 |
US8421207(B2) |
申请公布日期 |
2013.04.16 |
申请号 |
US20100881386 |
申请日期 |
2010.09.14 |
申请人 |
MUKAIDA HIDEKO;KABUSHIKI KAISHA TOSHIBA |
发明人 |
MUKAIDA HIDEKO |
分类号 |
H01L23/492 |
主分类号 |
H01L23/492 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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