发明名称 |
Methods and systems to meet technology pattern density requirements of semiconductor fabrication processes |
摘要 |
Techniques, systems, and methods are provided for optimizing pattern density fill patterns for integrated circuits. The method includes adjusting an area of a scribe line and a density of dummy fill shapes in the adjusted scribe line, while maintaining an area of the die, to achieve a pattern density associated with technology ground rules for a particular design of the die. |
申请公布号 |
US8423945(B2) |
申请公布日期 |
2013.04.16 |
申请号 |
US20100782337 |
申请日期 |
2010.05.18 |
申请人 |
BICKFORD JEANNE P.;CRUZ ALLAN O.;GILL MICHELLE;LANDIS HOWARD S.;MACDONNELL, II DAVID V.;SAMUELS DONALD J.;YERDON ROGER J.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BICKFORD JEANNE P.;CRUZ ALLAN O.;GILL MICHELLE;LANDIS HOWARD S.;MACDONNELL, II DAVID V.;SAMUELS DONALD J.;YERDON ROGER J. |
分类号 |
G06F17/50;G06F9/455 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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