发明名称 |
Semiconductor device with heat spreaders |
摘要 |
The semiconductor device has a unit stack body including a plurality of units stacked on one another. Each unit includes a power terminal constituted of a lead part and a connection part. The connection part is formed with a projection and a recess. When the units are stacked on one another, the projection of one unit is fitted to the recess of the adjacent unit, so that the power terminals of the respective unit are connected to one another.
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申请公布号 |
US8421235(B2) |
申请公布日期 |
2013.04.16 |
申请号 |
US201113173347 |
申请日期 |
2011.06.30 |
申请人 |
IDE SHIGEO;NIIMI AKIHIRO;DENSO CORPORATION |
发明人 |
IDE SHIGEO;NIIMI AKIHIRO |
分类号 |
H01L23/473;H01L23/48;H01L25/07;H01L25/10 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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