发明名称 |
Composition and methods of forming solder bump and flip chip using the same |
摘要 |
Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
|
申请公布号 |
US8420722(B2) |
申请公布日期 |
2013.04.16 |
申请号 |
US20090476925 |
申请日期 |
2009.06.02 |
申请人 |
EOM YONG SUNG;MOON JONG TAE;OH SANGWON;JANG KEONSOO;ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
EOM YONG SUNG;MOON JONG TAE;OH SANGWON;JANG KEONSOO |
分类号 |
B60C1/00 |
主分类号 |
B60C1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|