发明名称 |
Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device |
摘要 |
An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.
|
申请公布号 |
US8418910(B2) |
申请公布日期 |
2013.04.16 |
申请号 |
US201213367509 |
申请日期 |
2012.02.07 |
申请人 |
YAMAKAMI TAKATOYO;KUBOTA TAKASHI;ISHIKAWA KUNIKO;KITAJIMA MASAYUKI;FUJITSU LIMITED |
发明人 |
YAMAKAMI TAKATOYO;KUBOTA TAKASHI;ISHIKAWA KUNIKO;KITAJIMA MASAYUKI |
分类号 |
B23K35/14;B23K31/02;B23K35/34 |
主分类号 |
B23K35/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|