ABLATION PROCESSING METHOD OF SUBSTRATE LAMINATED WITH PASSIVATION FILM

摘要

PURPOSE: An ablation processing method for a substrate having a laminated passivation layer is provided to form a protection layer using liquid resin including fine oxide powder which absorbs the wavelength of a laser beam, thereby effectively preventing energy diffusion and laser beam reflection. CONSTITUTION: Liquid resin(80) containing fine oxide powder is coated on a substrate(W) to form a protection layer(82). A laser beam is irradiated on the substrate to perform an ablation process. The average size of the fine powder is smaller than the spot size of the laser beam. A supply nozzle(74) supplies the liquid resin to the surface of a wafer. A liquid resin supply source(76) stores the liquid resin. [Reference numerals] (76) Liquid resin supply source;