发明名称 |
Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board |
摘要 |
In the laminated and sintered ceramic circuit board according to the present invention, at least a portion of the inplane conductor is fine-lined, such that the shape of the cross-section surface of the fine-lined inplane conductor is trapezoid, and the height (a), the length (c) of the lower base and the length (d) of the upper base of the trapezoidal cross-section surfaces, and the interval (b) between the lower bases of the trapezoidal cross-section surfaces of the inplane conductors adjacent in a plane parallel to the principal surfaces of the board meet a certain relation. This provides a laminated ceramic circuit board with low open failure rate, short-circuit failure rate and high reliability against high temperature and high humidity in a downsized and short-in-height (thin) semiconductor package. |
申请公布号 |
US8421215(B2) |
申请公布日期 |
2013.04.16 |
申请号 |
US201113331253 |
申请日期 |
2011.12.20 |
申请人 |
TANI MAKOTO;HIRAI TAKAMI;YANO SHINSUKE;TANABE DAISHI;NGK INSULATORS, LTD. |
发明人 |
TANI MAKOTO;HIRAI TAKAMI;YANO SHINSUKE;TANABE DAISHI |
分类号 |
H01L23/12;H01L23/00;H01L23/053;H01L23/48;H01L23/52;H01L29/40;H05K1/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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