| 发明名称 |
Integrated circuit package system with warp-free chip |
| 摘要 |
An integrated circuit package system includes: a semiconductor chip; a stress-relieving layer on the semiconductor chip; an adhesion layer on the stress relieving layer; and electrical interconnects bonded to the adhesion layer.
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| 申请公布号 |
US8421197(B2) |
申请公布日期 |
2013.04.16 |
| 申请号 |
US201113023244 |
申请日期 |
2011.02.08 |
| 申请人 |
DO BYUNG TAI;SHIM IL KWON;DIMAANO, JR. ANTONIO B.;KUAN HEAP HOE;STATS CHIPPAC LTD. |
发明人 |
DO BYUNG TAI;SHIM IL KWON;DIMAANO, JR. ANTONIO B.;KUAN HEAP HOE |
| 分类号 |
H01L23/48;H01L23/49;H01L23/495;H01L23/50 |
主分类号 |
H01L23/48 |
| 代理机构 |
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