发明名称 |
Semiconductor device and connection checking method for semiconductor device |
摘要 |
Provided is a semiconductor device in which a connection between connection terminals and land of the semiconductor device can be checked with the semiconductor device kept in a sound condition, the connection not being allowed to be checked with a semiconductor chip. The semiconductor device of the present invention includes: a package substrate; a semiconductor chip mounted on the package substrate; a first land formed in a first principal surface of the package substrate; a second land formed in a second principal surface of the package substrate; first connection terminals connected to the second land and having the connection thereto not allowed to be checked with the semiconductor chip; a connection interconnection for connecting the first land and the second land; a second connection terminal formed in the second principal surface of the package substrate; and a branch interconnection for connecting the connection interconnection and the second connection terminal.
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申请公布号 |
US8421206(B2) |
申请公布日期 |
2013.04.16 |
申请号 |
US20090591424 |
申请日期 |
2009.11.19 |
申请人 |
AKIYAMA NAOTO;UMESHIMA TOSHIAKI;RENESAS ELECTRONICS CORPORATION |
发明人 |
AKIYAMA NAOTO;UMESHIMA TOSHIAKI |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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