发明名称 |
Method for the miniaturizable contacting of insulated wires |
摘要 |
The invention allows for the contacting of preferably microcomponents using electrical wires. By growing metallic microdepositions on cut surfaces of microcables, a contact region is generated which simplifies the dosing and application of a contact auxiliary and allows ultrasonic bonding, comprising a defined size of the electrically conductive area and allowing the contacting of very stably insulated wires. The application of this method in a panelized manner and in series is inexpensive.
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申请公布号 |
US8418911(B2) |
申请公布日期 |
2013.04.16 |
申请号 |
US200913133848 |
申请日期 |
2009.12.08 |
申请人 |
MEISS THORSTEN;ROSSNER TIM |
发明人 |
MEISS THORSTEN;ROSSNER TIM |
分类号 |
B23K1/06;B23K26/20;B23K31/02 |
主分类号 |
B23K1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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