发明名称 SYMMETRIC PLASMA PROCESS CHAMBER
摘要 PURPOSE: A symmetric plasma process chamber is provided to uniformly control plasma by enhancing the symmetry of electricity, gas flow, and heat. CONSTITUTION: A symmetric plasma process chamber comprises a chamber cover assembly(110), a chamber body assembly(140), and an exhaust assembly(190). The chamber cover assembly is insulated from the chamber body assembly and comprises an upper electrode(112) and a chamber cover(114). The upper electrode is supported by the chamber body assembly. The chamber body surrounds the upper electrode. The chamber body assembly comprises a chamber body(142). The chamber body is formed of conductive materials such as aluminum or stainless steel. The exhaust assembly is positioned on the bottom of the chamber body adjacent to a vacuum exhaust section(104).
申请公布号 KR20130037195(A) 申请公布日期 2013.04.15
申请号 KR20120114790 申请日期 2012.10.16
申请人 APPLIED MATERIALS, INC. 发明人 JAMES D. CARDUCCI;HAMID TAVASSOLI;AJIT BALAKRISHNA;ZHIGANG CHEN;ANDREW NGUYEN;DOUGLAS A. BUCHBERGER JR.;KARTIK RAMASWAMY;SHAHID RAUF;KENNETH S. COLLINS
分类号 C23C16/50;C23C16/455 主分类号 C23C16/50
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