METHOD FOR LIGHT EMITTING DEVICE WITH CAN PACKAGE AND THE LIGHT EMITTING DEVICE

摘要

PURPOSE: A method for manufacturing a can package type light emitting device and the light emitting device manufactured by the same are provided to simplify manufacturing processes and a structure of the light emitting device by adopting a substrate with a vertical insulation layer without withdrawing an electrode terminal to the outside of a sealed space. CONSTITUTION: A metal substrate with a vertical insulation layer is prepared(S10). A metal plate is bonded to the upper side of the metal substrate with the vertical insulation layer(S20). A cavity is formed on the metal substrate with the vertical insulation layer(S30). A middle product including a main wall and the upper side of the cavity is plated with metal(S40). A light emitting element is attached to a relatively large area of the cavity(S50). The light emitting element is connected to the relatively large area of the cavity through a wire(S60). An inner space of the cavity is filled with inert gases(S70). [Reference numerals] (AA) Start; (BB) End; (S10) Preparing a metal substrate with a vertical insulation layer; (S20) Bonding a metal plate on the upper side of the metal substrate with a vertical insulation layer; (S30) Processing a cavity; (S40) Plating metal; (S50) Attaching an optical device; (S60) Bonding a wire; (S70) Packing a protective plate and can cam and sealing inert gas;