发明名称 |
DRIVER PACKAGE |
摘要 |
<p>PURPOSE: A driver package is provided to rapidly dissipate the heat of a driver IC, thereby preventing the malfunction of a driver. CONSTITUTION: A first driver package includes a first driver IC(25) for producing a scan signal. The heat from the first driver IC is transferred to a first heat radiation member(101) via a second heat sink member(125). The first heat radiation member is connected to a print circuit board via a first and a second ground line.</p> |
申请公布号 |
KR20130036682(A) |
申请公布日期 |
2013.04.12 |
申请号 |
KR20110100909 |
申请日期 |
2011.10.04 |
申请人 |
LG DISPLAY CO., LTD. |
发明人 |
KIM, JIN HYOUNG;KIM, SEUNG TAE |
分类号 |
G02F1/1345;H01L23/34;H05B33/06 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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