发明名称 DRIVER PACKAGE
摘要 <p>PURPOSE: A driver package is provided to rapidly dissipate the heat of a driver IC, thereby preventing the malfunction of a driver. CONSTITUTION: A first driver package includes a first driver IC(25) for producing a scan signal. The heat from the first driver IC is transferred to a first heat radiation member(101) via a second heat sink member(125). The first heat radiation member is connected to a print circuit board via a first and a second ground line.</p>
申请公布号 KR20130036682(A) 申请公布日期 2013.04.12
申请号 KR20110100909 申请日期 2011.10.04
申请人 LG DISPLAY CO., LTD. 发明人 KIM, JIN HYOUNG;KIM, SEUNG TAE
分类号 G02F1/1345;H01L23/34;H05B33/06 主分类号 G02F1/1345
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