SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

摘要

PURPOSE: An apparatus and method for processing a substrate are provided to prevent a developer from being undulated by separately collecting a first processing solution and smoothly substituting the first processing solution for a second processing solution. CONSTITUTION: A first processing solution supply unit supplies a first processing solution to a substrate(G). A gas supply unit(21) supplies a preset gas to the surface of the substrate in which the first processing solution is collected. A second rinse nozzle discharges a second processing solution to the surface of the substrate. A first rinse nozzle(22) discharges the second processing solution to the surface of the substrate to which the gas is supplied. A solution collecting unit(27) forms a solution collected part extended in a width direction of the substrate on a substrate transfer path by the second processing solution supplied by the first rinse nozzle.