发明名称 |
SOLDER BALL PRINTING APPARATUS |
摘要 |
PURPOSE: A solder ball printing device is provided to properly manage the consumption of a solder ball by controlling solder ball supply time. CONSTITUTION: A solder ball printing device includes a mask(12) to print a solder ball on an electrode and a solder ball filling head. The solder ball filling head includes a solder ball filling unit(9) and a solder ball supply unit. A vertical driving device vertically moves the solder ball filling unit and the solder ball supply unit at the same time. A supply unit driving device vertically moves the solder ball supply unit. A syringe(18) is connected to the solder ball filling unit by an antistatic hose. The syringe stores the solder ball.
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申请公布号 |
KR20130036725(A) |
申请公布日期 |
2013.04.12 |
申请号 |
KR20120109964 |
申请日期 |
2012.10.04 |
申请人 |
HITACHI PLANT TECHNOLOGIES, LTD. |
发明人 |
IGARASHI AKIO;MIZUTORI RYOSUKE;HASHIMOTO NAOAKI;MITSUMOTO MASARU;HOMMA MAKOTO |
分类号 |
H01L21/60;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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