发明名称 SOLDER BALL PRINTING APPARATUS
摘要 PURPOSE: A solder ball printing device is provided to properly manage the consumption of a solder ball by controlling solder ball supply time. CONSTITUTION: A solder ball printing device includes a mask(12) to print a solder ball on an electrode and a solder ball filling head. The solder ball filling head includes a solder ball filling unit(9) and a solder ball supply unit. A vertical driving device vertically moves the solder ball filling unit and the solder ball supply unit at the same time. A supply unit driving device vertically moves the solder ball supply unit. A syringe(18) is connected to the solder ball filling unit by an antistatic hose. The syringe stores the solder ball.
申请公布号 KR20130036725(A) 申请公布日期 2013.04.12
申请号 KR20120109964 申请日期 2012.10.04
申请人 HITACHI PLANT TECHNOLOGIES, LTD. 发明人 IGARASHI AKIO;MIZUTORI RYOSUKE;HASHIMOTO NAOAKI;MITSUMOTO MASARU;HOMMA MAKOTO
分类号 H01L21/60;H05K3/34 主分类号 H01L21/60
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