| 摘要 |
PURPOSE: A light emitting device package is provided to enable an operator to reliably mount the light emitting device package on a substrate by closely attaching the substrate to the bottom of a light emitting device package body. CONSTITUTION: A body(410) includes a cavity, a first lead frame, and a second lead frame. The first lead frame is separated from the second lead frame. An optical source is mounted on the first lead frame or the second lead frame exposed to the cavity. The body includes a central part and a junction part. The central part includes a curved bottom surface(412D). The junction part is formed on both sides of the central part and includes a flat bottom surface(413D). The bottom surface of the junction part is lower than the bottom surface of the central part.
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