| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which improves an SN ratio of an output signal and is able to be manufactured at low cost, and provide a manufacturing method of the semiconductor device. <P>SOLUTION: A semiconductor device comprises: a first lead 13 to which a light-emitting element 21 is fastened; a second lead 14 connected to the light-emitting element through a first metal wire 23; a third lead 15 to which a light-receiving element 25 detecting light emitted from the light-emitting element is fastened; a fourth lead 16 connected to the light-receiving element through a second metal wire 27; and a molding body 10. The molding body encapsulates the light-emitting element and the light-receiving element inside, and includes a translucent part 9 and a light-shielding part 5. The translucent part covers on a first principal surface side of the molding body, a surface of the first lead to which the light-emitting element is fastened and a surface of the third lead to which the light-receiving element is fastened. The light-shielding part covers rear faces of the first lead through the fourth lead, respectively, and includes a component absorbing light to which the light-receiving element is sensitive. Each of the first lead through the fourth lead has a bonding surface on the first principal surface side. <P>COPYRIGHT: (C)2013,JPO&INPIT |
