发明名称 |
HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE |
摘要 |
A heating element mounting substrate includes a substrate including a first surface and a second surface, a plurality of wiring patterns formed on the first surface of the substrate, and a plurality of filled portions including a conductive material filled in a plurality of through-holes, the plurality of through-holes penetrating through the substrate in a thickness direction. At least one of the plurality of wiring patterns has an area of not less than 30% of an area of the first surface of the substrate. Areas of the plurality of filled portions overlapped with the plurality of wiring patterns are not less than 50% of respective areas of the corresponding wiring patterns as viewed from the second surface side of the substrate.
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申请公布号 |
US2013087368(A1) |
申请公布日期 |
2013.04.11 |
申请号 |
US201213645338 |
申请日期 |
2012.10.04 |
申请人 |
HITACHI CABLE, LTD;HITACHI CABLE, LTD |
发明人 |
IMAI NOBORU;ISAKA FUMIYA;MATSUO NAGAYOSHI;NEMOTO MASANORI;TANOI MINORU |
分类号 |
H05K1/00;H05K3/10 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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