| 摘要 |
A structure for encapsulating at least one electronic device, including at least one first cavity bounded by a support and at least one cap provided on the support and wherein the electronic device is encapsulated, at least one aperture passing through the cap and communicating the inside of the first cavity with at least one portion of getter material provided in at least one second cavity which is arranged on the support and adjacent to the first cavity, at least one part of said portion of getter material being provided on the support or against at least one outer side wall of the first cavity, the first cavity and the second cavity forming together a hermetically sealed volume.
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