BONDING DEVICE AND BONDED SUBSTRATE MANUFACTURED USING SAME

摘要

A bonding device (20) according to an embodiment of the present invention is provided with: a transporting film (7) which is elastic and on which an Si wafer (1) can be disposed; a chamber (6) which is divided into a bonding chamber (9) and an adjoining chamber (10), the bonding chamber (9) being configured to bond the Si wafer (1) to a glass substrate (2); and a pressure change means which decreases the pressure in the bonding chamber (9) to cause the transporting film (7) to extend so that the Si wafer (1) is brought into contact with the glass substrate (2).