METHOD OF RESOLVING SUBSTRATE WARPAGE PROBLEM DUE TO DIFFERENCES IN THERMAL COEFFICIENTS AND ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD MANUFACTURED THEREOF

摘要

PURPOSE: A solving method of a substrate warpage problem due to heat expansion contraction rate difference and an electronic component built-in printed circuit board applying the method are provided to prevent a warpage occurrence of the substrate by using a laminate-molded material in which maintaining more than 50% of the content of the ceramic filler. CONSTITUTION: A cavity is manufactured in an internal layer insulating layer(180) of a hardened status. An electronic component(170) is built in the cavity. A first insulation layer and a copper foil(190) of a semi-hardened status are laminated on the electronic component. A via hole is formed after the first insulation layer is solidified. The via hole electronically connects the copper foil of the substrate outside layer and an input-output terminal bump of the electronic component.