发明名称 |
SYSTEMS AND METHODS FOR AIR RELEASE IN CAVITY PACKAGES |
摘要 |
<p>A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.</p> |
申请公布号 |
WO2013052676(A1) |
申请公布日期 |
2013.04.11 |
申请号 |
WO2012US58769 |
申请日期 |
2012.10.04 |
申请人 |
ANALOG DEVICES, INC. |
发明人 |
GAO, JIA;YANG, JICHENG;SAIYED, SHAFI;NG, SIU, LUNG;XUE, XIAOJIE |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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