发明名称 SEMICONDUCTOR CRYSTAL SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR CRYSTAL SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, POWER SUPPLY DEVICE, AND AMPLIFIER
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor crystal substrate capable of suppressing an occurrence of a crack at a periphery of a substrate. <P>SOLUTION: A semiconductor crystal substrate 110 and a protective layer 120 formed on a surface of the substrate 110 with a nitride are provided. In the protective layer 120, a peripheral region 120a corresponding to a periphery of the substrate 110 is in an amorphous state and an internal region 120b corresponding to an area inside of the peripheral region of the substrate 110 is crystallized. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013065720(A) 申请公布日期 2013.04.11
申请号 JP20110203793 申请日期 2011.09.16
申请人 FUJITSU LTD 发明人 TOMABECHI SHUICHI
分类号 H01L21/20;H01L21/205;H01L21/336;H01L21/338;H01L29/778;H01L29/78;H01L29/812 主分类号 H01L21/20
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