| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-quality semiconductor device which is excellent in versatility and is not likely to cause poor appearance and poor electrical connection. <P>SOLUTION: A semiconductor device comprises: a body unit 2 including terminal strips 12 and 13 electrically connected with a semiconductor chip and a first mold resin 15 formed to encapsulate one ends of the semiconductor chip and the terminal strips inside; and a separation unit 3 which includes a second mold resin 20 having housing recesses 23 formed on an upper end face for embedding nuts 21, and which is assembled with the main unit in a detachable manner. Other ends of the terminal strips project from the first mold resin and tips 13d in a projection direction are bent so as to cover an upside of the first mold resin, and screw holes 17 are formed at the tips of the terminal strips, respectively. The separation unit is located between an upper end face of the first mold resin and the tips of the terminal strips by sliding movement and assembled with the body unit such that the nuts are arranged so as to face the screw holes. <P>COPYRIGHT: (C)2013,JPO&INPIT |
