| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flip-chip bonded semiconductor device which can change a potential of a specific terminal without changing an exterior package design. <P>SOLUTION: A semiconductor device of a present embodiment comprises: an IC chip including bumps on an external terminal; and a package on which the IC chip is mounted. The package includes an inner lead part applying a first signal or a second signal to the external terminal. The inner lead part has an inner lead pattern which enables the signal applied to the external terminal to be changed between the first signal and the second signal depending on a mounting position of the IC chip. <P>COPYRIGHT: (C)2013,JPO&INPIT |
