Arrangement for use in half-bridge module for arranging n-channel-MOSFET to half bridge circuit, has support plates comprising contact surfaces, where drain terminals of MOSFETS are applied on plates with surfaces and connected by lines

摘要

The arrangement has two support plates i.e. electrically conductive lead frames (SG1, SG2), comprising different large contact surfaces lying next to each other and arranged in a plane, where the support plates are made of plastic material. Source terminals (S1, S2) of MOSFETs (T1, T2) are applied on the support plates with a smaller contact surface. Drain terminals (D1, D2) of the MOSFETS are applied on the support plates with the larger contact surfaces and electrical conductively connected by connection lines. Independent claims are also included for the following: (1) a half-bridge module (2) a half-bridge arrangement.