| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer substrate which further reduces bump heights, improves the density of a package, and improves the reliability of the package in a flip chip or other packages having high density and multiple contacts, which has a planarized surface. <P>SOLUTION: A multilayer substrate includes: a surface dielectric layer 404 and at least one pad layer 402. The surface dielectric layer 404 is provided at one surface layer of the multilayer substrate, and the pad layer 402 is buried in the surface dielectric layer 404. The surface dielectric layer 404 and the pad layer 402 form the multilayer substrate of this invention. The at least one pad layer 402 is formed on a surface of a flat carrier, and the surface dielectric layer 404 covering the pad layer 402 is formed to allow the pad layer 402 to be buried in the surface dielectric layer 404. The multilayer substrate is separated from the surface of the carrier, and the surface dielectric layer 404 and the pad 402 form the multilayer substrate having a flat surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
