发明名称 CONDUCTIVE PARTICLE POWDER
摘要 <P>PROBLEM TO BE SOLVED: To provide a conductive particle powder which is excellent in adhesion between a core particle formed of an organic particle of a thermoplastic resin, a thermosetting resin, or the like or an inorganic particle and a conductive layer and is excellent in electrical conductivity and temporal stability. <P>SOLUTION: The conductive particle powder comprises a core particle formed of an inorganic particle of an aluminum oxide, a silicon oxide, or the like or an organic particle, and a conductive layer formed on the surface of the core particle. The conductive particle powder is characterized in that the conductive layer is formed via a surface modifier coating the surface of the core particle. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013065576(A) 申请公布日期 2013.04.11
申请号 JP20120285831 申请日期 2012.12.27
申请人 TODA KOGYO CORP 发明人 OSUGI MINEKO;MORII HIROKO;HAYASHI KAZUYUKI
分类号 H01B5/00;B22F1/02 主分类号 H01B5/00
代理机构 代理人
主权项
地址