发明名称 SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME
摘要 The semiconductor device includes: a transistor having a gate electrode formed on a semiconductor substrate and first and second source/drain regions formed in portions of the semiconductor substrate on both sides of the gate electrode; a gate interconnect formed at a position opposite to the gate electrode with respect to the first source/drain region; and a first silicon-germanium layer formed on the first source/drain region to protrude above the top surface of the semiconductor substrate. The gate interconnect and the first source/drain region are connected via a local interconnect structure that includes the first silicon-germanium layer.
申请公布号 US2013087862(A1) 申请公布日期 2013.04.11
申请号 US201213687407 申请日期 2012.11.28
申请人 PANASONIC CORPORATION;PANASONIC CORPORATION 发明人 OOSUKA TSUTOMU;OGAWA HISASHI;SATO YOSHIHIRO
分类号 H01L29/78 主分类号 H01L29/78
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