THERMAL MODULE

摘要

A thermal module adapted for dissipating heat of an electronic component includes a heat pipe; and two mounting flakes mounted on the heat pipe. The mounting flakes are configured for mounting the thermal module on a circuit board on which the electronic component is mounted. Each of the mounting flakes is formed integrally as a single piece. The mounting flake includes a fixing body and two mounting arms formed at two opposite ends of the fixing body. The fixing body is directly bonded on the heat pipe. The mounting arms extend beyond the heat pipe and define through holes therein for extension of fasteners.