发明名称 PLASMA-ENHANCED DEPOSITION OF TITANIUM-CONTAINING FILMS FOR VARIOUS APPLICATIONS USING AMIDINATE TITANIUM PRECURSORS
摘要 The present invention relates to a process for the use of Titanium amidinate metal precursors for the deposition of Titanium-containing films via Plasma Enhanced Atomic Layer Deposition (PEALD) or Plasma Enhanced Chemical Vapor Deposition (PECVD).
申请公布号 US2013089681(A1) 申请公布日期 2013.04.11
申请号 US201113269163 申请日期 2011.10.07
申请人 DUSSARRAT CHRISTIAN;OMARJEE VINCENT M.;LANSALOT-MATRAS CLEMENT;AMERICAN AIR LIQUIDE, INC. 发明人 DUSSARRAT CHRISTIAN;OMARJEE VINCENT M.;LANSALOT-MATRAS CLEMENT
分类号 C23C16/18 主分类号 C23C16/18
代理机构 代理人
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