RESIN COMPOSITION, INSULATION BODY FOR BUILD-UP PURPOSES WHICH COMPRISES SAID COMPOSITION, AND PREPREG PRODUCED USING SAID COMPOSITION

摘要

A resin composition characterized by comprising: an epoxy resin represented by formula (I); a phenolic resin represented by formula (II), which acts as a curing agent; and a polytetrafluoroethylene filler. In the formula, n represents an integer of 0 to 50, m represents an integer of 0 to 400, and A represents at least one bivalent group selected from a group (A) shown below.