| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an etching medium which can be employed in a technologically simple etching method with high potential throughputs for glass and other silicon oxide-based systems, and their layers of variable thickness, this simple etching method being significantly less expensive than conventional wet and dry etching methods in the liquid or gas phase. <P>SOLUTION: The present invention relates to printable, homogeneous, particle-free etching media having non-Newtonian flow behavior for etching inorganic glass-like or crystalline surfaces. <P>COPYRIGHT: (C)2013,JPO&INPIT |
