发明名称 MOM Capacitor Having Local Interconnect Metal Plates and Related Method
摘要 According to one exemplary embodiment, a metal-oxide-metal (MOM) capacitor in a semiconductor die comprises a first plurality of capacitor plates and a second plurality of capacitor plates sharing a plane parallel to and below a plane of a first metallization layer of the semiconductor die. The MOM capacitor further comprises a local interlayer dielectric between the first plurality of capacitor plates and the second plurality of capacitor plates. The first and second plurality of capacitor plates are made from a local interconnect metal for connecting devices formed in a device layer of the semiconductor die situated below the first metallization layer.
申请公布号 US2013087886(A1) 申请公布日期 2013.04.11
申请号 US201113270452 申请日期 2011.10.11
申请人 CHEN XIANGDONG;CHEN HENRY KUO-SHUN;BROADCOM CORPORATION 发明人 CHEN XIANGDONG;CHEN HENRY KUO-SHUN
分类号 H01L29/02;H01L21/02 主分类号 H01L29/02
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