| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser processing apparatus capable of irradiating a thickness direction of a workpiece with a plurality of shots of pulsed laser beams while processing and feeding the workpiece. <P>SOLUTION: The laser processing apparatus includes a laser beam irradiation means, a processing feeding means and a control means controlling the laser beam irradiation means and the processing feeding means based on a detection signal from a position detection means. The laser beam irradiation means includes: a pulsed laser beam oscillation means; and a piezoelectric motor for displacing a condenser including a condensing lens at a predetermined angle (α) with respect to the Z direction. The frequency and voltage of a high-frequency current to be applied to the piezoelectric motor are controlled relative to the repetition frequency of the pulsed laser beams to move the condenser in the X direction by Δx and in the Z direction by Δz when a chuck table is fed for processing. Thus, the light condensing point of the pulsed laser beams to be condensed by the condensing lens is displaced in the thickness direction of a predetermined region of the workpiece held on the chuck table. <P>COPYRIGHT: (C)2013,JPO&INPIT |
