| 摘要 |
<P>PROBLEM TO BE SOLVED: To restrict deterioration in the reliability of connections between an electronic component 2 and a conductive pattern 121 on a multilayer substrate 10 on which the electronic component 2 is mounted. <P>SOLUTION: In a multilayer substrate formed by hot-pressing a laminate 10a composed of second resin films 13 using thermoplastic resin as film backing and first resin films 12 using thermosetting resin as film backing and having conductive patterns 121 formed on one side thereof which are alternately laminated one on another, and a base film 11 on which an electronic component 2 is mounted, the base film 11 has terminal connection through holes 111 formed therein for connecting the conductive patterns 121 and electrode terminals 2a of the electronic component 2, and a component mounting part 101 overlapping the electronic component 2 when viewed from the laminated direction of the laminate 10a is composed in such a way that the number of conductive patterns 121 in the laminated direction is greater in overlapping parts 101a which overlap the terminal connection through holes 111 than in non-overlapping parts 101b which do not overlap the terminal connection through holes 111. <P>COPYRIGHT: (C)2013,JPO&INPIT |
