| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing-die bonding tape capable of dicing an adhesive layer precisely, and enhancing the pickup performance of a semiconductor chip with an adhesive layer. <P>SOLUTION: A dicing-die bonding tape 1 includes an adhesive layer 3, a base material layer 4 and a dicing layer 5. At the time of dicing, an annular dicing ring 26 is stuck to the outer periphery of the dicing layer 5. The dicing layer 5 has a diameter larger than that of the base material layer 4. When the inside diameter of the dicing ring is X, the diameter of the dicing layer 5 exceeds 1X, and the diameter of the base material layer 4 is 0.91X or larger. The manufacturing kit of a semiconductor chip with an adhesive layer has the dicing-die bonding tape 1 and the dicing ring 26. <P>COPYRIGHT: (C)2013,JPO&INPIT |
