| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a system and method for manufacturing a light emitting element, capable of improving production yield and area productivity by making light emission characteristics uniform; and a system and method for manufacturing a light emitting element package including the light emitting element mounted on a substrate. <P>SOLUTION: A light emitting element package includes an LED element having a top face coated with a resin including a phosphor. When, in manufacturing the light emitting element package, resin supply for discharging a resin to supply to an LED element which is taken out from an LED wafer to be rearranged in a predetermined alignment on an element holding face is performed, a translucent member to which the resin is supplied on trial for use in measurement of light emission characteristics is irradiated with excitation light from a light source to measure light emission characteristics of light emitted from the resin, and a proper resin supply amount is corrected on the basis of the measurement result and previously specified light emission characteristics to derive the proper resin supply amount of a resin to be supplied to the LED element for actual production. <P>COPYRIGHT: (C)2013,JPO&INPIT |
